STM32WBA62CGF6 datasheet(176/185 Pages) STMICROELECTRONICS

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STM32WBA6xxx

176/185

DS14736 Rev 1

Example of device marking for thin WLCSP88

Figure 47 gives an example of the locations and orientation of the marking areas versus ball

A1, and allows engineering samples to be identified.

With the device text markings oriented as shown below, ball A1 is always located at top left.

Table 104. Thin WLCSP88 - Mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

A(2)

2. The profile height A is the distance from the seating plane to the highest point on the package. It is

measured perpendicular to the seating plane.

0.50

0.0197

A1(3)

3. A1 is defined as the distance from the seating plane to the lowest point on the package body.

0.12

0.0047

0.30

0.0118

0.025

0.0010

b(4)

4. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to Datum C.

0.20

0.23

0.25

0.0079

0.0091

0.0098

D(5)

5. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For

tolerances, refer to form and position table. On the drawing, these dimensions are framed. For the

tolerances, refer to form and position values.

3.78 BSC

0.1488 BSC

D1(5)

3.03 BSC

0.1193 BSC

E(5)

3.46 BSC

0.1362 BSC

E1(5)

2.80 BSC

0.1102 BSC

eD(5)(6)

6. e represents the solder balls grid pitch(es).

0.61 BSC

0.0240 BSC

eE(5)(6)

0.35 BSC

0.0138 BSC

eS(5)(6)

0.35 BSC

0.0138 BSC

N(7)

7. N represents the total number of balls.

SD(5)(8)

8. Basic dimensions SD & SE are defining the ball matrix position with respect to datums A and B.

0.61 BSC

0.0240 BSC

SE(5)(8)

0.175 BSC

0.0069 BSC

aaa(9)

9. Tolerance of form and position drawing

0.02

0.0008

bbb(9)

0.06

0.0024

ccc(9)

0.03

0.0012

ddd(9)

0.015

0.0006

eee(9)

0.05

0.0020

STM32WBA62CGF6 Datasheet(PDF) 176 Page - STMicroelectronics

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