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STM32WBA62CGF6 Datasheet(PDF) 1 Page - STMicroelectronics

Part # STM32WBA62CGF6
Description  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33 with TrustZone , FPU, Bluetooth IEEE802.15.4 radio solution
PDF  185 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WBA62CGF6 Datasheet(HTML) 1 Page - STMicroelectronics

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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
December 2024
DS14736 Rev 1
1/185
STM32WBA6xxx
Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33
with TrustZone®, FPU, Bluetooth® IEEE802.15.4 radio solution
Datasheet
- preliminary data
Features
Includes ST state-of-the-art patented
technology
Ultra-low-power radio
• 2.4 GHz radio
• RF transceiver supporting Bluetooth® Low
Energy 5.4 specification,
IEEE 802.15.4-2015 PHY and MAC,
supporting Thread, Matter, and Zigbee®
• Proprietary protocols
• RX sensitivity: -96 dBm (Bluetooth® Low
Energy at 1 Mbps), -100 dBm
(IEEE 802.15.4 at 250 kbps)
• Programmable output power up to +10 dBm,
with 1 dB steps
• Support for external PA
• Isochronous channel (Auracast/Unicast),
AOA/AOD, long range
• Packet traffic arbitration
• Integrated balun to reduce BOM
• Single crystal operation
• Suitable for systems requiring compliance with
radio frequency regulations ETSI EN 300 328,
EN 300 440, FCC CFR47 Part 15 and ARIB
STD-T66
Ultra-low-power with FlexPowerControl
• 1.71 to 3.6 V power supply
• -40 to 85/105 °C ambient temperature range
• Autonomous peripherals with DMA, functional
down to Stop 1 mode
• 120 nA Standby mode (16 wake-up pins)
• 1.33 μA Standby mode with RTC
• 1.15 µA Standby mode with 64-Kbyte SRAM
• 5.30 µA Stop 2 mode with 64-Kbyte SRAM
• 29 µA/MHz Run mode
• Radio: Rx 4.26 mA / Tx at 0 dBm 5.94 mA
Core
• Arm® 32-bit Cortex®-M33 CPU with
TrustZone®, MPU, DSP, and FPU
ART Accelerator
• 8-Kbyte instruction cache allowing 0-wait-state
execution from flash memory (frequency up to
100 MHz, 150 DMIPS)
Benchmarks
• 1.5 DMIPS/MHz (Dhrystone 2.1)
• 410 CoreMark® (4.10 CoreMark/MHz)
Memories
• Up to 2-Mbyte dual bank flash memory with
ECC, including 512 Kbytes with 100 K cycles
• Up to 512-Kbyte SRAM, including 64 Kbytes
with parity check
• 512-byte (32 rows) OTP
UFQFPN48
7 x 7 mm solder pad
VFQFPN68
8 x 8 mm solder pad
Thin WLCSP88
3.78 x 3.46 mm
UFBGA121
6 x 6 mm
www.st.com


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