AMPL138ZCE3 datasheet(8/268 Pages) TI

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Contents

OMAP-L138 Low-Power Applications Processor

SPRS586A – JUNE 2009 – REVISED AUGUST 2009

www.ti.com

OMAP-L138 Low-Power Applications Processor

. 1

6.8

Power and Sleep Controller (PSC)

.................. 93

1.1

Features

.............................................. 1

6.9

EDMA

............................................... 98

1.2

Trademarks

........................................... 4

6.10

External Memory Interface A (EMIFA)

............. 104

1.3

Description

............................................ 5

6.11

DDR2/mDDR Controller

............................ 113

1.4

Functional Block Diagram

............................ 7

6.12

MMC / SD / SDIO (MMCSD0, MMCSD1)

......... 126

Revision History

......................................... 9

6.13

Serial ATA Controller (SATA)

...................... 129

Device Overview

........................................ 10

6.14

Multichannel Audio Serial Port (McASP)

.......... 131

3.1

Documentation Support

............................. 10

6.15

Multichannel Buffered Serial Port (McBSP)

........ 140

3.2

Device Characteristics

.............................. 10

6.16

Serial Peripheral Interface Ports (SPI0, SPI1)

..... 150

3.3

Device Compatibility

................................. 12

6.17

Inter-Integrated Circuit Serial Ports (I2C)

.......... 176

6.18

Universal Asynchronous Receiver/Transmitter

3.4

ARM Subsystem

.................................... 12

(UART)

............................................. 180

3.5

DSP Subsystem

..................................... 15

6.19

Universal Serial Bus OTG Controller (USB0)

3.6

Memory Map Summary

............................. 21

[USB2.0 OTG]

..................................... 182

3.7

Pin Assignments

.................................... 25

6.20

Universal Serial Bus Host Controller (USB1)

3.8

Pin Multiplexing Control

............................. 28

[USB1.1 OHCI]

..................................... 189

3.9

Terminal Functions

.................................. 29

6.21

Ethernet Media Access Controller (EMAC)

........ 190

Device Configuration

.................................. 65

6.22

Management Data Input/Output (MDIO)

........... 198

4.1

Boot Modes

......................................... 65

6.23

LCD Controller (LCDC)

............................ 200

4.2

SYSCFG Module

.................................... 65

6.24

Host-Port Interface (UHPI)

......................... 215

Device Operating Conditions

........................ 68

6.25

Universal Parallel Port (uPP)

...................... 223

5.1

Absolute Maximum Ratings Over Operating

6.26

Video Port Interface (VPIF)

........................ 228

Junction Temperature Range

6.27

Enhanced Capture (eCAP) Peripheral

............. 234

(Unless Otherwise Noted)

................................. 68

6.28

Enhanced High-Resolution Pulse-Width Modulator

5.2

Recommended Operating Conditions

............... 69

(eHRPWM)

......................................... 237

5.3

Electrical Characteristics Over Recommended

6.29

Timers

.............................................. 242

Ranges of Supply Voltage and Operating Junction

Temperature (Unless Otherwise Noted)

............ 71

6.30

Real Time Clock (RTC)

............................ 244

Peripheral Information and Electrical

6.31

General-Purpose Input/Output (GPIO)

............. 247

Specifications

........................................... 72

6.32

Programmable Real-Time Unit Subsystem

(PRUSS)

........................................... 251

6.1

Parameter Information

.............................. 72

6.2

Recommended Clock and Control Signal Transition

6.33

Emulation Logic

.................................... 254

Behavior

............................................. 73

Mechanical Packaging and Orderable

6.3

Power Supplies

...................................... 73

Information

............................................. 261

6.4

Reset

................................................ 74

7.1

Device Support

..................................... 261

6.5

Crystal Oscillator or External Clock Input

........... 77

7.2

Thermal Data for ZCE Package

................... 263

6.6

Clock PLLs

.......................................... 78

7.3

Thermal Data for ZWT Package

................... 264

6.7

Interrupts

............................................ 82

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