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AMPL138ZCE3 Datasheet(PDF) 1 Page - Texas Instruments

Part # AMPL138ZCE3
Description  OMAP-L138 Low-Power Applications Processor
PDF  268 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AMPL138ZCE3 Datasheet(HTML) 1 Page - Texas Instruments

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1
OMAP-L138 Low-Power Applications Processor
1.1 Features
OMAP-L138 Low-Power Applications Processor
www.ti.com
SPRS586A – JUNE 2009 – REVISED AUGUST 2009
(RCPxP) and Square-Root Reciprocal
• Dual Core SoC
Approximation (RSQRxP) Operations
–
300-MHz ARM926EJ-S™ RISC MPU
Per Cycle
–
300-MHz C674x VLIW DSP
–
Two Multiply Functional Units
• ARM926EJ-S Core
• Mixed-Precision IEEE Floating Point
–
32-Bit and 16-Bit (Thumb®) Instructions
Multiply Supported up to:
–
DSP Instruction Extensions
–
2 SP x SP -> SP Per Clock
–
Single Cycle MAC
–
2 SP x SP -> DP Every Two Clocks
–
ARM® Jazelle® Technology
–
2 SP x DP -> DP Every Three Clocks
–
EmbeddedICE-RT™ for Real-Time Debug
–
2 DP x DP -> DP Every Four Clocks
• ARM9 Memory Architecture
• Fixed Point Multiply Supports Two 32 x
32-Bit Multiplies, Four 16 x 16-Bit
• C674x Instruction Set Features
Multiplies, or Eight 8 x 8-Bit Multiplies
–
Superset of the C67x+™ and C64x+™ ISAs
per Clock Cycle, and Complex Multiples
–
2400/1800 C674x MIPS/MFLOPS
–
Instruction Packing Reduces Code Size
–
Byte-Addressable (8-/16-/32-/64-Bit Data)
–
All Instructions Conditional
–
8-Bit Overflow Protection
–
Hardware Support for Modulo Loop
–
Bit-Field Extract, Set, Clear
Operation
–
Normalization, Saturation, Bit-Counting
–
Protected Mode Operation
–
Compact 16-Bit Instructions
–
Exceptions Support for Error Detection and
• C674x Two Level Cache Memory Architecture
Program Redirection
–
32K-Byte L1P Program RAM/Cache
• Software Support
–
32K-Byte L1D Data RAM/Cache
–
TI DSP/BIOS™
–
256K-Byte L2 Unified Mapped RAM/Cache
–
Chip Support Library and DSP Library
–
Flexible RAM/Cache Partition (L1 and L2)
• 128K-Byte RAM Shared Memory
–
1024K-Byte Boot ROM
• 1.8V or 3.3V LVCMOS IOs (except for USB and
• Enhanced Direct-Memory-Access Controller 3
DDR2 interfaces)
(EDMA3):
• Two External Memory Interfaces:
–
2 Channel Controllers
–
EMIFA
–
3 Transfer Controllers
• NOR (8-/16-Bit-Wide Data)
–
64 Independent DMA Channels
• NAND (8-/16-Bit-Wide Data)
–
16 Quick DMA Channels
• 16-Bit SDRAM With 128 MB Address
–
Programmable Transfer Burst Size
Space
• TMS320C674x Floating-Point VLIW DSP Core
–
DDR2/Mobile DDR Memory Controller
–
Load-Store Architecture With Non-Aligned
• 16-Bit DDR2 SDRAM With 512 MB
Support
Address Space or
–
64 General-Purpose Registers (32 Bit)
• 16-Bit mDDR SDRAM With 256 MB
–
Six ALU (32-/40-Bit) Functional Units
Address Space
• Supports 32-Bit Integer, SP (IEEE Single
• Three Configurable 16550 type UART Modules:
Precision/32-Bit) and DP (IEEE Double
–
With Modem Control Signals
Precision/64-Bit) Floating Point
–
16-byte FIFO
• Supports up to Four SP Additions Per
–
16x or 13x Oversampling Option
Clock, Four DP Additions Every 2
• LCD Controller
Clocks
• Supports up to Two Floating Point (SP
• Two Serial Peripheral Interfaces (SPI) Each
or DP) Reciprocal Approximation
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
TMS320C6000, C6000 are trademarks of Texas Instruments.
ARM926EJ-S is a trademark of ARM Limited.
PRODUCT PREVIEW information concerns products in the
Copyright © 2009–2009, Texas Instruments Incorporated
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.


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