PIC16LC773-04SLASHSP datasheet(175/200 Pages) MICROCHIP

175 / 200 page

PIC16C77X

Advance Information

DS30275A-page 175

17.0

PACKAGING INFORMATION

17.1

Package Marking Information

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXXXXXX

AABBCDE

Example

PIC16C773-20/SO

XXXXXXXXXXXXXXXXXXXX

AABBCDE

28-Lead PDIP (Skinny DIP)

Example

PIC16C773-20/SP

9917HAT

9910SAA

AABBCAE

XXXXXXXXXXXX

28-Lead SSOP

9817SBP

20I/SS

PIC16C773

Example

Legend: MM...M

Microchip part number information

XX...X

Customer specific information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask

rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with

your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

XXXXXXXXXXXXXXXXXXXX

XXXXXXXXXXXXXXXXXXXXXXXX

XXXXXXXXXXX

AABBCDE

28-Lead CERDIP Windowed

XXXXXXXXXXX

PIC16C774/JW

Example

9905HAT

XXXXXXXXXXX

PIC16LC773-04/SP Datasheet(PDF) 175 Page - Microchip Technology

PIC16LC773-04/SP Datasheet(HTML) 175 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL