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TDA8029HL/C2 Datasheet(PDF) 47 Page - NXP Semiconductors

Part # TDA8029HL/C2
Description  Low power single card reader
PDF  58 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8029HL/C2 Datasheet(HTML) 47 Page - NXP Semiconductors

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2003 Oct 30
47
Philips Semiconductors
Product specification
Low power single card reader
TDA8029
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Human body model as defined in JEDEC Standard JESD22-A114-B, dated June 2000.
10 HANDLING
Inputs and outputs are protected against electrostatic discharge voltages during normal handling. However, to be totally
safe, it is desirable to take normal precautions appropriate to handling MOS devices.
11 THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDCIN
input voltage for the DC/DC converter
−0.5
+6.5
V
VDD
supply voltage
−0.5
+6.5
V
Vn
voltage limit
on pins SAM, SBM, SAP, SBP and VUP
−0.5
7.5
V
on all other pins
−0.5
VDD + 0.5 V
Ptot
continuous total power dissipation
Tamb = −40 to +90 °C
−
500
mW
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−
125
°C
Vesd
electrostatic discharge voltage
human body model;
note 1
on pins I/O, VCC, RST, CLK and GNDC
−6+6
kV
on pin PRES
−3+3
kV
on pins SAM and SBM
−1+1
kV
on other pins
−2+2
kV
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to
ambient
in free air
80
K/W



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