LMV342MASLASHNOPB datasheet(20/35 Pages) TI1

20 / 35 page

INPUT

Cbyp

OUTPUT

SHDN

GND

V+

LMV341-N, LMV342-N, LMV344-N

SNOS990H – APRIL 2002 – REVISED JUNE 2016

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Product Folder Links: LMV341-N LMV342-N LMV344-N

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10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed-circuit board need to be considered. A

6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is

introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power

supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin needs to be

bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V− pins need to

be bypassed.

It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive

ground connection.

Surface-mount components in 0805 size or smaller are recommended in the LMV341-N application circuits.

Designers can take advantage of the VSSOP miniature sizes to condense board layout to save space and

reduce stray capacitance.

10.2 Layout Example

Figure 48. PCB Layout Example

LMV342MA/NOPB Datasheet(PDF) 20 Page - Texas Instruments