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OPA552FA/500 Datasheet(PDF) 1 Page - Texas Instruments

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Part # OPA552FA/500
Description  High-Voltage, High-Current Operational Amplifiers
PDF  32 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA552FA/500 Datasheet(HTML) 1 Page - Texas Instruments

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OPA551, OPA552
SBOS100B – JULY 1999 – REVISED JANUARY 2016
OPA55x High-Voltage, High-Current Operational Amplifiers
1 Features
3 Description
The OPA551x devices are low-cost operational
1
•
Wide Supply Range: ±4 V to ±30 V
amplifiers with high-voltage (60-V) and high-current
•
High Output Current: 200 mA Continuous
(200-mA) capability.
•
Low Noise: 14 nV/
√Hz
The OPA551 is unity-gain stable and features high
•
Fully Protected:
slew rate (15 V/µs) and wide bandwidth (3 MHz). The
–
Thermal Shutdown
OPA552 is optimized for gains of 5 or greater, and
offers higher speed with a slew rate of 24 V/µs and a
–
Output Current-Limited
bandwidth of 12 MHz. Both devices are suitable for
•
Thermal Shutdown Indicator
telephony, audio, servo, and test applications.
•
Wide Output Swing: 2 V from Rail
These laser-trimmed, monolithic integrated circuits
•
Fast Slew Rate:
provide excellent low-level accuracy along with high
–
OPA551: 15 V/µs
output swing. High performance is maintained as the
amplifier swings to its specified limits.
–
OPA552: 24 V/µs
•
Wide Bandwidth:
The OPA55x devices are internally protected against
overtemperature conditions and current overloads.
–
OPA551: 3 MHz
The thermal shutdown indicator flag provides a
–
OPA552: 12 MHz
current output to alert the user when thermal
•
Packages: PDIP-8, SOIC-8, or DDPAK/TO-263-7
shutdown has occurred.
The OPA55x devices are available in PDIP-8 and
2 Applications
SOIC-8 packages, as well as a DDPAK-7/TO-263
•
Telephony
surface-mount plastic power package. They are
specified for operation over the extended industrial
•
Test Equipment
temperature range, –40°C to +125°C.
•
Audio Amplifiers
•
Transducer Excitation
Device Information(1)
•
Servo Drivers
PART NUMBER
PACKAGE
BODY SIZE (NOM)
PDIP (8)
9.81 mm × 6.35 mm
OPA55x
SOIC (8)
4.9 mm × 3.91 mm
DDPAK/TO-263 (7)
10.1 mm × 8.99 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Functional Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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