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AR0141CS Datasheet(PDF) 63 Page - ON Semiconductor |
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AR0141CS Datasheet(HTML) 63 Page - ON Semiconductor |
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63 / 64 page  AR0141CS/D Rev. 6, 4/16 EN 63 ©Semiconductor Components Industries, LLC, 2016. AR0141CS: 1/4-Inch Digital Image Sensor Package Drawings Package Drawings Figure 51: 63-Ball iBGA Package (Case 503AH) Notes: 1. Dimensions are in mm. Dimensions in () are for reference only. 2. Encapsulant: Epoxy. 3. Substrate material: Epoxy laminate 0.25 thickness. Double AR glass. 4. LID MATERIAL: BOROSILICATE GLASS 0.4±0.4MM thickness Refractive Index at 20C = 1.5255 @ 546 nm and 1.5231 @ 588 nm. Double Side AR Coating: 530-570nm R<1%; 420-700nm R<2%. 5. Image sensor die: 0.2 thickness. 6. Solder ball material: SAC 305 (95% Sn, 3% Ag, 0.5% Cu). Dimensions apply to solder balls post reflow. Pre-reflow ball is 0.5 on a 0.4 SMD ball pad. IBGA63 9x9 CASE 503AH ISSUE O DATE 30 DEC 2014 |
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