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STM32WB55CC Datasheet(PDF) 104 Page - STMicroelectronics |
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STM32WB55CC Datasheet(HTML) 104 Page - STMicroelectronics |
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104 / 165 page ![]() Electrical characteristics STM32WB55xx 104/165 DS11929 Rev 3 6.3.9 Wakeup time from Low-power modes and voltage scaling transition times The wakeup times given in Table 49 are the latency between the event and the execution of the first user instruction. The device goes in Low-power mode after the WFE (Wait For Event) instruction. APB2 AHB to APB2(4) 1.10 0.885 1.35 µA/MHz TIM1 8.20 6.80 7.25 TIM17 TBD TBD TBD TIM16 2.75 2.30 2.55 USART1 independent clock domain TBD TBD TBD USART1 clock domain TBD TBD TBD SPI1 TBD TBD TBD SAI1 independent clock domain TBD TBD TBD SAI1 clock domain TBD TBD TBD All APB2 on TBD TBD TBD ALL TBD TBD TBD µA/MHz 1. The BusMatrix is automatically active when at least one master is ON (CPU, DMA). 2. The GPIOx (x= A…H) dynamic current consumption is approximately divided by a factor two vs. the values of this table when the GPIO port is locked through the LCKK and LCKy bits in the GPIOx_LCKR register. To save the full GPIOx current consumption, the GPIOx clock needs to be disabled in the RCC when all port I/Os are used in alternate function or analog mode (clock is only required to read or write into GPIO registers, and is not used in AF or analog modes). 3. The AHB to APB1 bridge is automatically active when at least one peripheral is ON on the APB1. 4. The AHB to APB2 bridge is automatically active when at least one peripheral is ON on the APB2. Table 48. Peripheral current consumption (continued) Peripheral Range 1 Range 2 Low-power run and sleep Unit Table 49. Low-power mode wakeup timings(1) Symbol Parameter Conditions Typ Max Unit tWUSLEEP Wakeup time from Sleep mode to Run mode -9 10 No. of CPU cycles tWULPSLEEP Wakeup time from Low-power sleep mode to Low-power run mode Wakeup in Flash with memory in power-down during low-power sleep mode (FPDS = 1 in PWR_CR1) and with clock MSI = 2 MHz 910 |
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