STM32WB55CC datasheet(26/165 Pages) STMICROELECTRONICS

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STM32WB55CC Datasheet(PDF) 26 Page - STMicroelectronics

Part #	STM32WB55CC

Description	Multiprotocol wireless 32-bit MCU Arm

PDF	165 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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26 / 165 page

Functional overview

STM32WB55xx

26/165

DS11929 Rev 3

During power up/ down, the following power sequence requirements must be respected:

•

When VDD is below 1 V, other power supplies (VDDA, VDDUSB, VLCD), must remain

below VDD + 300 mV

•

When VDD is above 1 V, all power supplies are independent.

Figure 5. Power-up/down sequence

1. VDDX refers to any power supply among VDDA, VDDUSB, VLCD.

During the power down phase, VDD can temporarily become lower than other supplies only

if the energy provided to the MCU remains below 1 mJ. This allows the external decoupling

capacitors to be discharged with different time constants during the power down transient

phase.

Note:

VDD, VDDRF and VDDSMPS must be wired together, so they follow the same voltage

sequence.

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