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STM32WB55CC Datasheet(PDF) 158 Page - STMicroelectronics

Part # STM32WB55CC
Description  Multiprotocol wireless 32-bit MCU Arm
PDF  165 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WB55CC Datasheet(HTML) 158 Page - STMicroelectronics

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Package information
STM32WB55xx
158/165
DS11929 Rev 3
7.4
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 22: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated
using the equation:
TJ max = TA max + (PD max x ΘJA)
where:
•
TA max is the maximum ambient temperature in °C,
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watt. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins:
•
PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Note:
When the SMPS is used, a portion of the power consumption is dissipated into the external
inductor, therefore reducing the chip power dissipation. This portion depends mainly on the
inductor ESR characteristics.
Note:
As the radiated RF power is quite low (< 4 mW), it is not necessary to remove it from the
chip power consumption.
Note:
RF characteristics (such as sensitivity, Tx power, consumption) are provided up to 85 °C.
7.4.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
7.4.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Section 8.
Each temperature range suffix corresponds to a specific guaranteed ambient temperature at
maximum dissipation and, to a specific maximum junction temperature.
Table 97. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
UFQFPN48 - 7 mm x 7 mm
51
°C/W
Thermal resistance junction-ambient
VFQFPN68 - 8 mm x 8 mm
47
Thermal resistance junction-ambient
WLCSP100 - 0.4 mm pitch
44



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