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EMC1812 Datasheet(PDF) 19 Page - Microchip Technology |
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EMC1812 Datasheet(HTML) 19 Page - Microchip Technology |
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19 / 102 page ![]() 5.8 External Diode Connections The EMC1812 can be configured to measure a CPU substrate transistor, a discrete 2N3904 thermal diode, or an CPU/GPU processor diode. The diodes can be connected as indicated in the figure below. The EMC1813 can be configured to measure a CPU substrate transistor, a discrete 2N3904 thermal diode, or an CPU/GPU processor diode on the External Diode 1 or External Diode 2 channels. For the EMC1814, External Diode 2 and External Diode 3 channels are configured to measure a pair of discrete anti-parallel diodes (shared on pins DP2 and DN2). The supported configurations for the external diode channels are shown in the following figure. Figure 5-2. Diode Configurations Local Ground to DP1 Typical remote substrate transistor e.g. CPU substrate PNP Typical remote discrete NPN transistor e.g. 2N3904 to DN1 to DP2/DN3 to DN2/DP3 Anti-parallel connected discrete NPN transistors e.g. 2N3904 to DP1 to DN1 5.9 Power States The EMC1812/13/14/15/33 devices have two power states: Active and Standby. • Active (Run) - In this state, the ADC is converting on all temperature channels at the programmed conversion rate. The temperature data is updated at the end of every conversion and the limits are checked. In the Active state, writing to the One-shot register has no effects. • Standby (One-shot) - While the device is in Standby, the host can initiate a conversion cycle on demand. After the conversion cycle is complete, the device returns to the Standby state. 5.10 Conversion Rates The EMC1812/13/14/15/33 devices may be configured for different conversion rates based on the system requirements. The default conversion rate is four conversions per second. Other available conversion rates are shown in the Conversion Rate table. Multi-Channel Low-Voltage Remote Di... System Block Diagram © 2018 Microchip Technology Inc. Datasheet DS20005751A-page 19 |
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