EMC1812 datasheet(4/102 Pages) MICROCHIP

4 / 102 page

Table of Contents

Features.......................................................................................................................... 1

Typical Applications.........................................................................................................1

Description.......................................................................................................................1

Package Type..................................................................................................................2

Functional Block Diagram................................................................................................3

1. Electrical Characteristics........................................................................................... 6

1.1.

Absolute Maximum Ratings..........................................................................................................6

2. Typical Operating Curves........................................................................................ 10

3. Pin Descriptions.......................................................................................................11

3.1.

Power Supply (VDD)................................................................................................................... 12

3.2.

Diode 1 Pair (DN1/DP1)............................................................................................................. 12

3.3.

THERM LIMIT ALERT (THERM/ADDR).................................................................................... 12

3.4.

Ground (GND)............................................................................................................................ 12

3.5.

Maskable ALERT (ALERT/THERM2).........................................................................................12

3.6.

SMBus/I2C Data (SDA).............................................................................................................. 12

3.7.

DP/DP1...................................................................................................................................... 12

3.8.

DN/DN1...................................................................................................................................... 12

3.9.

DP2............................................................................................................................................ 12

3.10. DN2............................................................................................................................................ 12

3.11. Anti-Parallel Diode Pair (DP2/DN3 and DN2/DP3).................................................................... 12

3.12. Anti-Parallel Diode Pair (DP1/DN2 and DN1/DP2).................................................................... 13

3.13. Anti-Parallel Diode Pair (DP3/DN4 and DN3/DP4).................................................................... 13

3.14. SMBus Clock (SCL)................................................................................................................... 13

3.15. Exposed Thermal Pad (EP)........................................................................................................13

4. Detailed Description................................................................................................ 14

5. System Block Diagram............................................................................................ 15

5.1.

Temperature Measurement........................................................................................................ 15

5.2.

Temperature Measurement Results and Data............................................................................15

5.3.

Limit Registers............................................................................................................................16

5.4.

Limit Register Interaction............................................................................................................17

5.5.

ALERT/THERM2 Output............................................................................................................ 17

5.6.

THERM Output...........................................................................................................................18

5.7.

THERM Pin Address Decoding.................................................................................................. 18

5.8.

External Diode Connections.......................................................................................................19

5.9.

Power States.............................................................................................................................. 19

5.10. Conversion Rates.......................................................................................................................19

Multi-Channel Low-Voltage Remote Diode Sensor Family

Datasheet

DS20005751A-page 4

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