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EMC1812 Datasheet(PDF) 96 Page - Microchip Technology |
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EMC1812 Datasheet(HTML) 96 Page - Microchip Technology |
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96 / 102 page  RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C Contact Pad Spacing Contact Pitch MILLIMETERS 0.50 BSC MIN E MAX 1.90 Contact Pad Length (X10) Contact Pad Width (X10) Y1 X1 0.85 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2332A NOM 10-Lead Very Thin Plastic Dual Flat, No Lead Package (9R) - 2.5x2.0 mm Body [VDFN] SILK SCREEN 1 2 Contact Pad to Center Pad (X10) G1 0.20 e C Y1 X1 G 10 Multi-Channel Low-Voltage Remote Di... Packaging Information © 2018 Microchip Technology Inc. Datasheet DS20005751A-page 96 |
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