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TMS320F28375DPZP Datasheet(PDF) 215 Page - Texas Instruments

Part # TMS320F28375DPZP
Description  TMS320F2837xD Dual-Core Microcontrollers
PDF  226 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMS320F28375DPZP Datasheet(HTML) 215 Page - Texas Instruments

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EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
(15.4)
(15.4)
96X (0.5)
100X (1.5)
100X (0.3)
(
0.2) TYP
VIA
(
8.64)
(
12)
NOTE 10
(R0.05) TYP
(1) TYP
(1) TYP
PowerPAD
TQFP - 1.2 mm max height
PZP0100N
PLASTIC QUAD FLATPACK
4223383/A 04/2017
TM
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
EXPOSED METAL SHOWN
LAND PATTERN EXAMPLE
SCALE:5X
SYMM
SYMM
100
76
26
50
51
75
1
25
SOLDER MASK
DEFINED PAD
METAL COVERED
BY SOLDER MASK
101
SEE DETAILS
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
www.ti.com
TMS320F28379D, TMS320F28379D-Q1, TMS320F28378D, TMS320F28377D
TMS320F28377D-Q1, TMS320F28376D, TMS320F28375D, TMS320F28374D
SPRS880O – DECEMBER 2013 – REVISED FEBRUARY 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: TMS320F28379D TMS320F28379D-Q1 TMS320F28378D TMS320F28377D
TMS320F28377D-Q1 TMS320F28376D TMS320F28375D TMS320F28374D



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