TMS320F28375DPZP datasheet(219/226 Pages) TI

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EXAMPLE STENCIL DESIGN

(8.07)

BASED ON

0.125 THICK STENCIL

172X (0.5)

176X (1.45)

176X (0.3)

(R0.05) TYP

(25.5)

(7.33)

BASED ON

0.125 THICK

STENCIL

6.82 X 6.2

0.175

7.37 X 6.69

0.150

8.07 X 7.33 (SHOWN)

0.125

9.02 X 8.2

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

PowerPAD

HLQFP - 1.6 mm max height

PTP0176F

PLASTIC QUAD FLATPACK

4223382/A 03/2017

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have diﬀerent recommendations for stencil design.

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:4X

THICKNESSES

FOR OTHER STENCIL

DIFFERENT OPENINGS

SEE TABLE FOR

SYMM

176

133

132

BY SOLDER MASK

METAL COVERED

177

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TMS320F28379D, TMS320F28379D-Q1, TMS320F28378D, TMS320F28377D

TMS320F28377D-Q1, TMS320F28376D, TMS320F28375D, TMS320F28374D

SPRS880O – DECEMBER 2013 – REVISED FEBRUARY 2021

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TMS320F28377D-Q1 TMS320F28376D TMS320F28375D TMS320F28374D

TMS320F28375DPZP Datasheet(PDF) 219 Page - Texas Instruments

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