TMS320F28375DPZP datasheet(216/226 Pages) TI

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EXAMPLE STENCIL DESIGN

(

8.64)

96X (0.5)

100X (1.5)

100X (0.3)

(R0.05) TYP

(15.4)

7.3 X 7.3

0.175

7.89 X 7.89

0.150

8.64 X 8.64 (SHOWN)

0.125

9.66 X 9.66

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

PowerPAD

TQFP - 1.2 mm max height

PZP0100N

PLASTIC QUAD FLATPACK

4223383/A 04/2017

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

BASED ON

0.125 THICK STENCIL

SYMM

100

BY SOLDER MASK

METAL COVERED

101

TMS320F28379D, TMS320F28379D-Q1, TMS320F28378D, TMS320F28377D

TMS320F28377D-Q1, TMS320F28376D, TMS320F28375D, TMS320F28374D

SPRS880O – DECEMBER 2013 – REVISED FEBRUARY 2021

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TMS320F28375DPZP Datasheet(PDF) 216 Page - Texas Instruments

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