VSC8658 datasheet(90/95 Pages) MICROSEMI

Part #	VSC8658

Description	Octal 10/100/1000BASE-T PHY and 100BASEFX/1000BASE-X SerDes

PDF	95 Pages

Scroll/Zoom	100%

Manufacturer	MICROSEMI [Microsemi Corporation]

Direct Link	http://www.microsemi.com

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90 / 95 page

Package Information

VMDS-10242 VSC8658 Datasheet Revision 4.1

Package Information

The VSC8658 device is available in two package types. VSC8658HJ is a 444-pin, thermally enhanced,

plastic ball grid array (BGA) with a 27 mm × 27 mm body size, 1 mm pin pitch, and a 2.36 mm maximum

height. The device is also available in a lead(Pb)-free package, VSC8658XHJ.

Lead(Pb)-free products from Microsemi comply with the temperatures and profiles defined in the joint

IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC

standard.

This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the

VSC8658 device.

8.1

Package Drawing

The following illustration shows the package drawing for the VSC8658 device. The drawing contains the

top view, bottom view, side view, dimensions, tolerances, and notes.

VSC8658 Datasheet(PDF) 90 Page - Microsemi Corporation