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VSC8658 Datasheet(PDF) 92 Page - Microsemi Corporation |
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VSC8658 Datasheet(HTML) 92 Page - Microsemi Corporation |
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92 / 95 page ![]() Package Information VMDS-10242 VSC8658 Datasheet Revision 4.1 84 To achieve results similar to the modeled thermal resistance measurements, the guidelines for board design described in the JEDEC standard EIA/JESD51 series must be applied. For information about specific applications, see the following: EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms EIA/JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages EIA/JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements EIA/JESD51-10, Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements EIA/JESD51-11, Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements 8.3 Moisture Sensitivity Moisture sensitivity level ratings for Microsemi products comply with the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. VSC8658HJ is rated moisture sensitivity level 3 or better. VSC8658XHJ is rated moisture sensitivity level 4. For more information, see the IPC and JEDEC standard. |
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