6.4 Thermal Resistance Characteristics

THERMAL METRIC

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TLV3011-EP

TLV3012-EP

UNIT

DBV

(SOT-23)

DBV

(SOT-23)

6 PINS

6 PINS

R θJA

Junction-to-ambient thermal resistance

191.9

162.5

°C/W

R θJC(top)

Junction-to-case (top) thermal resistance

123.9

78.8

°C/W

R θJB

Junction-to-board thermal resistance

38.7

42.1

°C/W

ψ JT

Junction-to-top characterization parameter

21.2

21.2

°C/W

ψ JB

Junction-to-board characterization parameter

38.2

41.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics report.

6.5 Recommended Operating Conditions - TLV3011-EP

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

1.8

5.5

V

Input voltage range from (V–)

–0.2

(V+) + 0.2

V

Output voltage range from (V–)

–0.2

≤ V+

V

Ambient temperature, TA

–55

125

°C

6.6 Recommended Operating Conditions - TLV3012-EP

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

Supply voltage: VS = (V+) – (V–)

1.65

5.5

V

Input voltage range from (V–)

–0.2

(V+) + 0.2

V

Ambient temperature, TA

–55

125

°C

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TLV3011-EP, TLV3012-EP

SGLS349A – OCTOBER 2006 – REVISED MAY 2023

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