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HE84G762B Datasheet(PDF) 6 Page - King blillion Electronics Co.,Ltd.

Part # HE84G762B
Description  8-BIT MICRO-CONTROLLER
PDF  60 Pages
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Manufacturer  KB [King blillion Electronics Co.,Ltd.]
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HE84G762B Datasheet(HTML) 6 Page - King blillion Electronics Co.,Ltd.

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KING BILLION ELECTRONICS CO., LTD
駿
億
電
子
股
份
有
限
公
司
HE84G762B
HE80004 Series
June 1, 2004
6
V0.92
This specification is subject to change without notice. Please contact sales person for the latest version before use.
Pin Name
Pin # I/O
Description
refer to LCD driver configuration for details.
SEG[47..40]/D[7..0]
155~
162
O
LCD segment SEG[47..40] outputs share pads with data bus D[7..0] of external
memory.
SEG[39..16]/A[23..0]
163~
186
O
LCD segment SEG[39..16] outputs share pads with address bus A[23..0] of external
memory.
OE/SEG15
187
O
Output Enable control of external memory shares pad with SEG[15]. The function of
the pin is selected by mask option MO_EXMEM.
When used as Output Enable control pin, this pin control the tri-state buffer of external
memory data bus.
WE/SEG14
188
O
Write Enable control of external memory shares pad with SEG[14]. The function of the
pin is selected by mask option MO_ EXMEM.
When used as Write Enable control pin, this pin controls Write Enable input of the
external memory device.
CS0/SEG13
1
O
Chip Select 0 of external memory shares pad with SEG[13]. The function of the pin is
selected by mask option MO_ EXMEM.
When used as Chip Enable control pin, this pin select or de-select the external memory
device based on the address been accessed.
CS1/SEG12
2
O
Chip Select 1 of external memory shares pad with SEG[12]. The function of the pin is
selected by mask option MO_ EXMEM.
When used as Chip Enable control pin, this pin select or de-select the external memory
device based on the address been accessed.
CS2/SEG11
3
O
Chip Select 2 of external memory shares pad with SEG[11]. The function of the pin is
selected by mask option MO_ EXMEM.
When used as Chip Enable control pin, this pin select or de-select the external memory
device based on the address been accessed.
CS3/SEG10
4
O
Chip Select 3 of external memory shares pad with SEG[10]. The function of the pin is
selected by mask option MO_ EXMEM.
When used as Chip Enable control pin, this pin select or de-select the external memory
device based on the address been accessed.
PRT15[1..0]/SEG[9..8]
5~
6
B/
O
2-bit bi-directional I/O port 15 is shared with LCD segment pads SEG[9..8]. The
function of the pad can be selected individually by mask options MO_LIO15[1..0].
(‘1’ for LCD and ‘0’ for I/O).
The output type of I/O pad can also be selected by mask option MO_15PP[1..0] (1 for
push-pull and ‘0’ for open-drain).
As the output structure of I/O pad does not contain tri-state buffer. When using the I/O
as input, “1” must be outputted before reading.
PRT17[7..0]/SEG[7..0]
7~14
B/
O
8-bit bi-directional I/O port 17 is shared with LCD segment pads SEG[7..0]. The
function of the pad can be selected individually by mask options MO_LIO17[7..0].
(‘1’ for LCD and ‘0’ for I/O).
The output type of I/O pad can also be selected by mask option MO_17PP[7..0] (1 for
push-pull and ‘0’ for open-drain).
As the output structure of I/O pad does not contain tri-state buffer. When using the I/O
as input, “1” must be outputted before reading.
I: Input, O: Output, B: Bidirectional, P: Power.
5. Pad Locati
PIN
PIN
X
Y
Number
Name
Coordinate
Coordinate
------------------------------------------------------------------------
1
SEG[13]
X= -4123.60
Y=
934.55
2
SEG[12]
X= -4123.60
Y=
834.55



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