MPC8358E datasheet(85/96 Pages) FREESCALE

85 / 96 page

MPC8358E PowerQUICC™ II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 1

Freescale Semiconductor

Thermal

4. Insert the chosen SPMF, COREPLL, CEPMF and CEPDF to the RCWL fields respectively.

Example:

•

To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC

Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. “s10” and “c1” are

selected from Table 74. SPMF is “1000,” CORPLL is “0000011,” CEPMF is “01001,” and CEPDF

is “0.”

23 Thermal

This section describes the thermal specifications of the MPC8358E.

23.1

Thermal Characteristics

Table 75 provides the package thermal characteristics for the 668 29 mm x 29 mm PBGA package.

SPMF

CORE

PLL

CEPMF CEPDF

Input Clock

(MHz)

CSB Freq

(MHz)

Core Freq

(MHz)

QUICC

Engine

Freq (MHz)

400

(MHz)

1000

0000011

01001

266

400

300

∞

Table 75. Package Thermal Characteristics for the PBGA Package

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient Natural Convection on single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient Natural Convection on four layer board (2s2p)

RθJA

°C/W

1, 2, 3

Junction-to-ambient (@1 m/s) on single layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board thermal

RθJB

6°C/W

Junction-to-case thermal

RθJC

4°C/W

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