MPC8358E datasheet(88/96 Pages) FREESCALE

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MPC8358E PowerQUICC™ II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 1

Freescale Semiconductor

Thermal

RθJA = junction to ambient thermal resistance (°C/W)

RθJC = junction to case thermal resistance (°C/W)

RθCA = case to ambient thermal resistance (°C/W)

RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to

change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat

sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit

board, or change the thermal dissipation on the printed circuit board surrounding the device.

To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been

simulated with a few commercially available heat sinks. The heat sink choice is determined by the

application environment (temperature, air flow, adjacent component power dissipation) and the physical

space available. Because there is not a standard application environment, a standard heat sink is not

required.

Table 76 shows heat sinks and junction-to-case thermal resistance for PBGA package.

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamics software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More

detailed thermal models can be made available on request.

Table 76. Heat Sinks and Junction-to-Case Thermal Resistance of PBGA Package

Heat Sink Assuming Thermal Grease

Air Flow

× 29 mm PBGA

Thermal Resistance

AAVID 30

× 30 × 9.4 mm Pin Fin

Natural Convection

12.6

AAVID 30

× 30 × 9.4 mm Pin Fin

1 m/s

8.2

AAVID 30

× 30 × 9.4 mm Pin Fin

2 m/s

7.0

AAVID 31

× 35 × 23 mm Pin Fin

Natural Convection

10.5

AAVID 31

× 35 × 23 mm Pin Fin

1 m/s

6.6

AAVID 31

× 35 × 23 mm Pin Fin

2 m/s

6.1

Wakefield, 53

× 53 × 25 mm Pin Fin

Natural Convection

9.0

Wakefield, 53

× 53 × 25 mm Pin Fin

1 m/s

5.6

Wakefield, 53

× 53 × 25 mm Pin Fin

2 m/s

5.1

MEI, 75

× 85 × 12 no adjacent board, extrusion

Natural Convection

9.0

MEI, 75

× 85 × 12 no adjacent board, extrusion

1 m/s

5.7

MEI, 75

× 85 × 12 no adjacent board, extrusion

2 m/s

5.1

MPC8358E Datasheet(PDF) 88 Page - Freescale Semiconductor, Inc

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