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WS9623AB3DF Datasheet(PDF) 4 Page - Vimicro Corp.

Part # WS9623AB3DF
Description  128 MHz high performance CPU processor
PDF  19 Pages
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Manufacturer  VIMICRO [Vimicro Corp.]
Direct Link  http://www.vimicro.com/
Logo VIMICRO - Vimicro Corp.

WS9623AB3DF Datasheet(HTML) 4 Page - Vimicro Corp.

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WS9623AB3DF
Datasheet (V1.2)
Copyright © Vimicro_wx, Inc. 1999-2014
4
OVERVIEW
WS9623AB3DF is a stereo single chip headset solution based on Bluetooth protocol. It consists of 128 MHz high
performance CPU processor, SRAM, via ROM Bluetooth baseband controller, MODEM, RF, Audio CODEC, PMU,
etc. The protocol stack is stored in the on-chip ROM. It is fully compliant with all the mandatory features of
Bluetooth version 4.1 + EDR specification.
FEATURES
 128 MHz high performance CPU processor.
 Internal 512KB via ROM.
 Internal 4M bit SPI flash.
 -92dBm RX sensitivity and +9dBm TX output
power capability
 Logic for forward error correction, header
error control, access code correlation, CRC,
demodulation, encryption bit stream
generation, and whitening and transmit pulse
shaping.
 Fully qualified Bluetooth v4.1 + EDR feature
including eSCO and AFH.
 Internal 128KB SRAM. Allows full-speed
data transfer with full piconet support, mixed
voice and data, including all EDR packet
types.
 Audio transcoders for A-
law, μ-law and linear
voice from host and A-
law, μ-law and CVSD
voice over air.
 UART interface with programmable baud
rate up to 3Mbps for HCI communication.
 Multiple I
2C interface for external EEPROM.
 Boot loader with external memory interface
for software debugging.
 Internal 32 KHz oscillator for low power
operation.
 QFN48 package.
 SPI flash support. Operation voltage is 3.3V.
 Battery power display support. Allows user to
use buttons to trigger a tone/speech tone or
a led, to prompt the current battery.
 SPP support. Increased SPP protocol, which
is used to transmit commands and data,
realize interaction control with other
equipment that supports SPP.
 AT Command support. Communicates with
MCU through the UART,controlled by the
MCU,or converted the command to
bluetooth command,sent to the mobile
phone to realize the control of the phone by
MCU.
 Working temperature range -40 to +80 ℃.
 Dual Mic Acoustic Noise Cancellation. Used
to eliminate the stationary and
non-stationary noise on Tx.
 Single-microphone echo Cancellation. Used
to cancel acoustic echo.
 Single-microphone noise suppression. Used
to reduce stationary noise on Tx and Rx
 Packet Loss Concealment. Used to restore
audio quality in difficult RF environment on
Rx.
 Equalizer. Supports six arbitrarily frequency
bands and the bandwidth can be adjusted.
 Automatic Gain Control. Performs automatic
volume adjustment of the signal on Tx and
Rx.
 Speech Tone. Encoded with SBC (Sub-Band
Codec) format and stored in FLASH, to
indicate general event from headset by
specified tone directly.
 Advanced multi-point support. Allows
connecting 2 devices (either phones or pads)
and handling multiple calls or music at the
same time.
 Bluetooth Air path parameter configuration.
 24 bit Audio codec, -98dB SNR.
 Low radio power realizes 10+meter
communication (class2).
 Fast charger: 30 minutes charging time.
 No Balun filter required for connection.
 Battery monitor designed for smart phones.
 Watch dog for link loss alarm.
 Virtual Surround Sound for headphone and
loudspeakers support. Create a perceived
widened or surrounding sound image.
 Bass Enhancement support. Boosts the low
frequency part of the signal and leaves the
remaining part of the frequency range
unchanged in terms of loudness and timbre.
This gives the possibility to create extreme
bass enhancement.



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