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STM32WBA62CG Datasheet(PDF) 180 Page - STMicroelectronics

Part # STM32WBA62CG
Description  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33 with TrustZone , FPU, Bluetooth IEEE802.15.4 radio solution
PDF  185 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WBA62CG Datasheet(HTML) 180 Page - STMicroelectronics

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STM32WBA6xxx
180/185
DS14736 Rev 1
Figure 49. UFBGA121 - Footprint example
6.6
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the specified values.
TJ max (in Celsius degrees) can be calculated using the equation:
TJ max = TA max + (PD max x ΘJA)
where:
•
TA max is the maximum ambient temperature in °C
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max)
•
PINT max is the product of IDD and VDD, expressed in Watt (this is the maximum chip
internal power)
PI/O max represents the maximum power dissipation on output pins:
•
PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
Table 106. UFBGA121 - Example of PCB design rules
Dimension
Values
Pitch
0.5 mm
Dpad
0.225 mm
Dsm
0.290 mm typ. (depends on soldermask registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
BGA_WLCSP_FT_V1
Dsm
Dpad



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