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STM32WBA62CG Datasheet(PDF) 180 Page - STMicroelectronics |
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STM32WBA62CG Datasheet(HTML) 180 Page - STMicroelectronics |
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180 / 185 page ![]() Package information STM32WBA6xxx 180/185 DS14736 Rev 1 Figure 49. UFBGA121 - Footprint example 6.6 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the specified values. TJ max (in Celsius degrees) can be calculated using the equation: TJ max = TA max + (PD max x ΘJA) where: • TA max is the maximum ambient temperature in °C • ΘJA is the package junction-to-ambient thermal resistance, in °C/W • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max) • PINT max is the product of IDD and VDD, expressed in Watt (this is the maximum chip internal power) PI/O max represents the maximum power dissipation on output pins: • PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH) taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. Table 106. UFBGA121 - Example of PCB design rules Dimension Values Pitch 0.5 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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