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LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
38 of 70
NXP Semiconductors
LPC1766
Fast communication chip
9.
Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, TJ (°C), can be calculated using the following
equation:
(1)
• TA = ambient temperature (°C),
• θJA = the package junction-to-ambient thermal resistance ( °C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
J
T
A
P
D
θ
JA
×
()
+
=
Table 5.
Thermal characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
θ
JA
thermal resistance
LQFP100 package
-
<tbd>
-
°C/W
TJ(MAX)
maximum junction
temperature
--150
°C
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