NXP Semiconductors
LPC1766
Fast communication chip
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 August 2008
Document identifier: LPC1766_0.02
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13
DAC electrical characteristics . . . . . . . . . . . . 62
14
Application information. . . . . . . . . . . . . . . . . . 63
14.1
Suggested USB interface solutions . . . . . . . . 63
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 66
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 67
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 68
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 69
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 69
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
18.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 69
19
Contact information. . . . . . . . . . . . . . . . . . . . . 69
20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
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