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LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
47 of 70
NXP Semiconductors
LPC1766
Fast communication chip
11. Dynamic characteristics
11.1 Flash memory
11.2 External clock
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25
°C), nominal supply voltages.
Table 9.
Flash characteristics
Tamb = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
PECYC
number of
program/erase cycles
-
10 000
20 000
-
cyc
TRET
data retention
-
10
20
-
years
TPROG
word program time
-
<tbd>
<tbd>
<tbd>
μs
TERASE
page erase time
-
<tbd>
<tbd>
<tbd>
ms
TME
global erase time
-
<tbd>
<tbd>
<tbd>
ms
Table 10.
Dynamic characteristic: external clock
Tamb = −40 °C to +85 °C for industrial applications; VDD(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc
oscillator frequency
1
-
24
MHz
Tcy(clk)
clock cycle time
42
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Fig 14. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
tCHCL
tCLCX
tCHCX
Tcy(clk)
tCLCH
002aaa907
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