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LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
52 of 70
NXP Semiconductors
LPC1766
Fast communication chip
11.8 SPI
Table 16.
Dynamic characteristics of SPI pins
Tamb = −40 °C to +85 °C for industrial applications
Symbol
Parameter
Min
Typ
Max
Unit
SPI master
TSPICYC
SPI cycle time
<tbd>
<tbd>
<tbd>
ns
tSPICLKH
SPICLK HIGH time
<tbd>
<tbd>
<tbd>
ns
tSPICLKL
SPICLK LOW time
<tbd>
<tbd>
<tbd>
ns
tSPIDSU
SPI data set-up time
<tbd>
<tbd>
<tbd>
ns
tSPIDH
SPI data hold time
<tbd>
<tbd>
<tbd>
ns
tSPISEDV
SPI shifting edge to output data valid time
<tbd>
<tbd>
<tbd>
ns
tSPIOH
SPI output data hold time
<tbd>
<tbd>
<tbd>
ns
SPI slave
TSPICYC
SPI cycle time
<tbd>
<tbd>
<tbd>
ns
tSPICLKH
SPICLK HIGH time
<tbd>
<tbd>
<tbd>
ns
tSPICLKL
SPICLK LOW time
<tbd>
<tbd>
<tbd>
ns
tSPIDSU
SPI data set-up time
<tbd>
<tbd>
<tbd>
ns
tSPIDH
SPI data hold time
<tbd>
<tbd>
<tbd>
ns
tSPISEDV
SPI shifting edge to output data valid time
<tbd>
<tbd>
<tbd>
ns
tSPIOH
SPI output data hold time
<tbd>
<tbd>
<tbd>
ns
Fig 20.
SPI master timing (CPHA = 1)
SCK (CPOL = 0)
MOSI
MISO
002aad986
tSPICLK
tSPICLKH
tSPICLKL
tSPIDSU
tSPIDH
tSPISEDV
DATA VALID
DATA VALID
tSPIOH
SCK (CPOL = 1)
DATA VALID
DATA VALID
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