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LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
66 of 70
NXP Semiconductors
LPC1766
Fast communication chip
16. Abbreviations
Table 22.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CAN
Controller Area Network
DAC
Digital-to-Analog Converter
DCC
Debug Communication Channel
DMA
Direct Memory Access
DSP
Digital Signal Processing
EOP
End Of Packet
ETM
Embedded Trace Macrocell
GPIO
General Purpose Input/Output
IrDA
Infrared Data Association
JTAG
Joint Test Action Group
MIIM
Media Independent Interface Management
PHY
Physical Layer
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RMII
Reduced Media Independent Interface
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
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