65 / 70 page
LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
65 of 70
NXP Semiconductors
LPC1766
Fast communication chip
15. Package outline
Fig 36. Package outline SOT407-1 (LQFP100)
UNIT
A
max.
A1
A2
A3
bp
cE(1)
eHE
LLp
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
0.5
16.25
15.75
1.15
0.85
7
0
o
o
0.08
0.08
0.2
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT407-1
136E20
MS-026
00-02-01
03-02-20
D(1)
(1)
(1)
14.1
13.9
HD
16.25
15.75
E
Z
1.15
0.85
D
b p
e
θ
E
A1
A
L p
detail X
L
(A )
3
B
25
c
D
H
b p
E
H
A2
v M B
D
ZD
A
Z E
e
v M A
X
1
100
76
75
51
50
26
y
pin 1 index
w M
w M
0
5
10 mm
scale
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
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