OR2C04A datasheet(68/192 Pages) ETC

68 / 192 page

Data Sheet

ORCA Series 2 FPGAs

June 1999

Lucent Technologies Inc.

Pin Information (continued)

Package Compatibility

The package pinouts are consistent across

ORCA

Series FPGAs with the following exception: some user

I/O pins that do not have any special functions will

be converted to VDD5 pins for the OR2TxxA series.

If the designer does not use these pins for the

OR2CxxA and OR2TxxB series, then pinout compati-

bility will be maintained between the

ORCA OR2CxxA,

OR2TxxA, and OR2TxxB series of FPGAs. Note that

they must be connected to a power supply for the

OR2TxxA series.

Package pinouts being consistent across all

ORCA

Series FPGAs enables a designer to select a package

based on I/O requirements and change the FPGA with-

out laying out the printed-circuit board again. The

change might be to a larger FPGA if additional func-

tionality is needed, or it might be to a smaller FPGA to

decrease unit cost.

Table 18A provides the number of user I/Os available

for the

ORCA OR2CxxA and OR2TxxB Series FPGAs

for each available package, and Table 18B provides the

number of user I/Os available in the

ORCA OR2TxxA

series. It should be noted that the number of user I/Os

available for the OR2TxxA series is reduced from the

equivalent OR2CxxA devices by the number of

required VDD5 pins, as shown in Table 18B. The pins

that are converted from user I/O to VDD5 are denoted

as I/O-VDD5 in the pin information tables (Table 19

through 28). Each package has six dedicated configu-

ration pins.

Table 19—Table 28. provide the package pin and pin

function for the

ORCA Series 2 FPGAs and packages.

The bond pad name is identified in the PIC nomencla-

ture used in the

ORCA Foundry design editor.

When the number of FPGA bond pads exceeds the

number of package pins, bond pads are unused. When

the number of package pins exceeds the number of

bond pads, package pins are left unconnected (no

connects). When a package pin is to be left as a no

connect for a specific die, it is indicated as a note in the

device pad column for the FPGA. The tables provide no

information on unused pads.

* 432 EBGA not available for OR2T15B

Table 18A.

ORCA OR2CxxA and OR2TxxB Series FPGA I/Os Summary

Device

84-Pin

PLCC

100-Pin

TQFP

144-Pin

TQFP

160-Pin

QFP

208-Pin

SQFP/

SQFP2

240-Pin

SQFP/

SQFP2

256-Pin

PBGA

304-Pin

SQFP/

SQFP2

352-Pin

PBGA

432-Pin

EBGA

OR2C04A

User I/Os

114

130

160

—

VDD/VSS

—

OR2C06A

User I/Os

114

130

171

192

—

VDD/VSS

—

OR2C08A

User I/Os

—

130

171

192

221

—

VDD/VSS

—

OR2C10A

User I/Os

—

130

171

192

221

—

256

—

VDD/VSS

—

OR2C12A

User I/Os

—

171

192

223

252

288

—

VDD/VSS

—

422646

—

OR2C15A/OR2T15B

User I/Os

—

171

192

223

252

298

320*

VDD/VSS

—

422646

OR2C26A

User I/Os

—

171

192

—

252

298

342

VDD/VSS

—

OR2C40A/OR2T40B

User I/Os

—

171

192

—

252

—

342

VDD/VSS

—

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