OR2C04A datasheet(127/192 Pages) ETC

127 / 192 page

Data Sheet

June 1999

ORCA Series 2 FPGAs

Lucent Technologies Inc.

127

Package Thermal Characteristics (continued)

FPGA Maximum Junction Temperature

Once the power dissipated by the FPGA has been determined (see the Estimating Power Dissipation section), the

maximum junction temperature of the FPGA can be found. This is needed to determine if speed derating of the

device from the 85 °C junction temperature used in all of the delay tables is needed. Using the maximum ambient

temperature, TAmax, and the power dissipated by the device, Q (expressed in °C), the maximum junction tempera-

ture is approximated by:

TJmax = TAmax + (Q •

ΘJA)

Table 29 lists the thermal characteristics for all packages used with the Series 2 FPGAs.

1. Mounted on a sparse copper one-layer test board.

2. Mounted on four-layer JEDEC standard test board with two power/ground planes.

3. With thermal balls connected to board ground plane.

4. Without thermal balls connected to board ground plane.

Note: The ψJC for the packages listed is <1 °C/W. This implies that virtually all of the heat is dissipated through the board on which the package

is mounted.

Table 29. Series 2 Plastic Package Thermal Guidelines

Package

ΘJA (°C/W)

TA = 70 °C max

TJ = 125 °C max

@ 0 fpm (W)

0 fpm

200 fpm

500 fpm

84-Pin PLCC1

40.0

35.0

—

1.4

100-Pin TQFP2

30.0—27.0

26—23

24.0—21.0

1.8—2.0

144-Pin TQFP1

52.0

39.0

—

1.1

160-Pin QFP2

24.0

21.5

20.5

2.3

208-Pin SQFP2

26.5

23.0

21.0

2.1

208-Pin SQFP22

12.8

10.3

9.1

4.3

240-Pin SQFP2

25.5

22.5

21.0

2.2

240-Pin SQFP22

13.0

10.0

9.0

4.2

256-Pin PBGA2, 3

22.5

19.0

17.5

2.4

256-Pin PBGA2, 4

26.0

22.0

20.5

2.1

304-Pin SQFP2

27.5

24.0

22.5

2.0

304-Pin SQFP22

12.0

10.0

9.0

4.6

352-Pin PBGA2, 3

19.0

16.0

15.0

2.9

352-Pin PBGA2, 4

25.5

22.0

20.5

2.1

432-Pin EBGA2

11.0

8.5

7.5

5.0

Package Coplanarity

The coplanarity limits of the Series 2 series packages

are as follows:

TQFP: 3.15 mils

PLCC and QFP: 4.0 mils

PBGA: 8.0 mils

SQFP: 4.0 mils (240 and 304 only)

3.15 mils (all other sizes)

SQFP2: 3.15 mils

EBGA: 8.0 mils

Package Parasitics

The electrical performance of an IC package, such as

signal quality and noise sensitivity, is directly affected

by the package parasitics. Table 30 lists eight parasitics

associated with the

ORCA packages. These parasitics

represent the contributions of all components of a

package, which include the bond wires, all internal

package routing, and the external leads.

Four inductances in nH are listed: LSW and LSL, the

self-inductance of the lead; and LMW and LML, the

mutual inductance to the nearest neighbor lead.

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