10XSC425 datasheet(10/56 Pages) FREESCALE

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Analog Integrated Circuit Device Data



Freescale Semiconductor

10XSC425

THERMAL RATINGS

Operating Temperature

•Ambient

•Junction

-40 to 125

-40 to 150

C

(5)

TSTG

Storage Temperature

-55 to 150

C

THERMAL RESISTANCE

RJC

RJA

Thermal Resistance

• Junction to Case

• Junction to Ambient

<2.5

C/W

(7)

TSOLDER

Peak Pin Reflow Temperature During Solder Mounting

260

C

(8)

Notes

To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not

exceed 125

C.

Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board).

Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Symbol

Ratings

Value

Unit

Notes

10XSC425 Datasheet(PDF) 10 Page - Freescale Semiconductor, Inc

10XSC425 Datasheet(HTML) 10 Page - Freescale Semiconductor, Inc

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