PIC16LC773-04SLASHSP datasheet(152/200 Pages) MICROCHIP

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PIC16C77X

DS30275A-page 152

Advance Information

15.1

DC Characteristics: PIC16C77X (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial and

0°C

≤ TA ≤ +70°C for commercial

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

D001A

Supply Voltage

VDD

4.0

4.5

—

5.5

XT, RC and LP osc configuration

HS osc configuration

D002*

RAM Data Retention

Voltage (Note 1)

VDR

—1.5

—

D003

VDD start voltage to

ensure internal Power-on

Reset signal

VPOR

—VSS

—

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on Reset

signal

SVDD

0.05

—

V/ms See section on Power-on Reset for details.

PWRT enabled

D010

D013

Supply Current (Note 2)

IDD

—

2.7

13.5

XT, RC osc configuration

FOSC = 4 MHz, VDD = 5.5V (Note 4)

HS osc configuration

FOSC = 20 MHz, VDD = 5.5V

D020

D020A

Power-down Current

(Note 3)

IPD

—

1.5

µA

VDD = 4.0V, -0

°C to +70°C

VDD = 4.0V, -40

°C to +85°C

Module Differential Cur-

rent (Note 5)

D021

Watchdog Timer

∆IWDT

—6.0

µAVDD = 4.0V

D023*

D023B*

Brown-out Reset Current

(Note 5)

Bandgap voltage

generator

∆IBOR

∆IBG6

TBD

—

200

µA

—

TBD

µA

BOR enabled, VDD = 5.0V

D025*

Timer1 oscillator

∆IT1OSC

—5

µAVDD = 4.0V

D026*

A/D Converter

∆IAD

—300

—

µAVDD = 5.5V, A/D on, not converting

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-

sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: The

∆ current is the additional current consumed when the peripheral is enabled. This current should be

added to the base (IPD or IDD) current.

6: The bandgap voltate reference provides 1.22V to the VRL, VRH, LVD and BOR circuits. When calculating cur-

rent consumption use the following formula:

∆IVRL + ∆IVRH + ∆ILVD + ∆IBOR + ∆IBG. Any of the ∆IVRL, ∆IVRH,

∆ILVD or ∆IBOR can be 0.

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