GND

VIN

VOUT

LOAD

Pin A1

GND

TPS82740A, TPS82740B

www.ti.com

SLVSCE3A – JUNE 2014 – REVISED JUNE 2014

Figure 46. PCB Layout Suggestion

13.3 Surface Mount Information

The TPS82740 MicroSIP™ module uses an open frame construction for a fully automated assembly process and

provides a large surface area for pick and place operations. See the "Pick Area" in the package drawing.

Package height and weight have been kept to a minimum, allowing MicroSIP™ device handling similar to a 0805

footprint component.

For reflow recommendations, see document J-STD-20 from the JEDEC/IPC standard.

Copyright © 2014, Texas Instruments Incorporated

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