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EXAMPLE STENCIL DESIGN

METAL

UNDER PASTE

(

)

0.34

(1) TYP

(0.8)

TYP

(

) TYP

SEE DETAIL

0.34

MicroSiP - 1.1 mm max height

SIP0009F

MICRO SYSTEM IN PACKAGE

4221589/A 06/2014

TM

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SYMM

SYMM

1

3

A

B

C

2

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:20X

SOLDER PASTE DETAIL

TYPICAL