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MMPF0200 Datasheet(PDF) 102 Page - NXP Semiconductors |
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MMPF0200 Datasheet(HTML) 102 Page - NXP Semiconductors |
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102 / 114 page  102 NXP Semiconductors PF0200 TYPICAL APPLICATIONS 7.2 PF0200 layout guidelines 7.2.1 General board recommendations 1. It is recommended to use an eight layer board stack-up arranged as follows: • High current signal •GND • Signal • Power • Power • Signal •GND • High current signal 2. Allocate TOP and BOTTOM PCB Layers for POWER ROUTING (high-current signals), copper-pour the unused area. 3. Use internal layers sandwiched between two GND planes for the SIGNAL routing. 7.2.2 Component placement It is desirable to keep all component related to the power stage as close to the PMIC as possible, specially decoupling input and output capacitors. 7.2.3 General routing requirements 1. Some recommended things to keep in mind for manufacturability: • Via in pads require a 4.5 mil minimum annular ring. Pad must be 9.0 mils larger than the hole • Maximum copper thickness for lines less than 5.0 mils wide is 0.6 oz copper • Minimum allowed spacing between line and hole pad is 3.5 mils • Minimum allowed spacing between line and line is 3.0 mils Internal references, VCOREDIG, VCOREREF, VCORE 1.0 μF 1 10 V X5R 0402 CC0402KRX5R6BB105 Yageo America VCOREDIG 1.0 μF 1 10 V X5R 0402 CC0402KRX5R6BB105 Yageo America VCORE 0.22 μF 1 10 V X5R 0402 GRM155R61A224KE19D Murata VCOREREF Coin cell 0.1 μF 1 10 V X5R 0402 C0402C104K8PAC Kemet LICELL Miscellaneous 0.1 μF 1 10 V X5R 0402 C0402C104K8PAC Kemet VDDIO 1.0 μF 1 10 V X5R 0402 CC0402KRX5R6BB105 Yageo America VIN 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER PWRON 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER RESETBMCU 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER SDWN 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER INTB Notes 78. Freescale does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or tables. While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. Table 123. Bill of materials (78) (continued) Value Qty Description Part# Manufacturer Component/pin |
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