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MCP48CMB21 Datasheet(PDF) 75 Page - Microchip Technology

Part # MCP48CMB21
Description  8/10/12-Bit Digital-to-Analog Converters, 1 LSb INL Single/Dual Voltage Outputs with SPI Interface
PDF  106 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP48CMB21 Datasheet(HTML) 75 Page - Microchip Technology

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 2019 Microchip Technology Inc.
DS20006160A-page 75
MCP48CXBXX
8.0
TYPICAL APPLICATIONS
The MCP48CXBXX devices are general purpose,
single/dual-channel voltage output DACs for various
applications where a precision operation with low power is
needed.
Applications generally suited for the devices are:
• Set Point or Offset Trimming
• Sensor Calibration
• Portable Instrumentation (Battery-Powered)
• Motor Control
8.1
Design Considerations
In the design of a system with the MCP48CXBXX
devices, the following considerations should be taken
into account:
• Power Supply Considerations
• Layout Considerations
8.1.1
POWER SUPPLY
CONSIDERATIONS
The power source supplying these devices must be as
clean as possible. If the application circuit has separate
digital and analog power supplies, VDD and VSS may
reside on the analog plane.
The power supply to the device is also used for the
DAC voltage reference internally if the internal VDD is
selected as the resistor ladder’s reference voltage.
The typical application requires a bypass capacitor in
order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity.
Any noise induced on the VDD line can affect the DAC
performance. Typical applications require a bypass
capacitor in order to filter out high-frequency noise on
the VDD line. The noise can be induced onto the power
supply’s traces or as a result of changes on the DAC out-
put. The bypass capacitor helps to minimize the effect of
these noise sources on signal integrity. Figure 8-1
shows an example of using two bypass capacitors (a
10 µF tantalum capacitor and a 0.1 µF ceramic capaci-
tor) in parallel on the VDD line. These capacitors should
be placed as close to the VDD pin as possible (within
4 mm). If the application circuit has separate digital and
analog power supplies, the VDD and VSS pins of the
device should reside on the analog plane.
FIGURE 8-1:
Example Circuit.
Analog
VDD
2
3
4
9
7
CS
SCK
SDO
VSS
VOUT0
8
To MCU
C1:
0.1 µF capacitor
= Ceramic
C2:
10 µF capacitor
= Tantalum
C3:
~ 0.1 µF
= Optional to reduce noise
in VOUT pin.
C4:
0.1 µF capacitor
= Ceramic
C5:
10 µF capacitor
= Tantalum
C6:
0.1 µF capacitor
= Ceramic
C2
C1
MCP48CXBX2
Optional
(a) Circuit when VDD is selected as reference.
(Note: VDD is connected to the reference circuit internally.)
(b) Circuit when external reference is used.
Output
VREF
5
6 LAT/HVC
VOUT1
C4
C3
Analog
VDD
2
3
4
9
7
CS
SCK
SDO
VSS
VOUT0
8
To MCU
C2
C1
MCP48CXBX2
Optional
Output
VREF
5
6 LAT/HVC
VOUT1
C5
Optional
VREF
C6
C4
C3
1
10
VDD
SDI
1
10
VDD
SDI



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