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MMPF0100 Datasheet(PDF) 9 Page - NXP Semiconductors

Part # MMPF0100
Description  14 channel configurable power management integrated circuit
PDF  136 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MMPF0100 Datasheet(HTML) 9 Page - NXP Semiconductors

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NXP Semiconductors
9
PF0100
PIN CONNECTIONS
29
VHALF
I
3.6 V
Analog
Half supply reference for VREFDDR
30
VINREFDDR
I
3.6 V
Analog
VREFDDR regulator input. Bypass with at least 1.0
μF decoupling capacitor
as close to the pin as possible.
31
VREFDDR
O
3.6 V
Analog
VREFDDR regulator output
32
SW3VSSSNS
GND
-
GND
Ground reference for the SW3 regulator. Connect to GNDREF externally via
the board ground plane.
33
SW3BFB (6)
I
3.6 V
Analog
Output voltage feedback for SW3B. Route this trace separately from the high
current path and terminate at the output capacitance.
34
SW3BIN (6)
I
4.8 V
Analog
Input to SW3B regulator. Bypass with at least a 4.7
μF ceramic capacitor
and a 0.1
μF decoupling capacitor as close to the pin as possible.
35
SW3BLX (6)
O
4.8 V
Analog
Regulator 3B switch node connection
36
SW3ALX (6)
O
4.8 V
Analog
Regulator 3A switch node connection
37
SW3AIN (6)
I
4.8 V
Analog
Input to SW3A regulator. Bypass with at least a 4.7
μF ceramic capacitor
and a 0.1
μF decoupling capacitor as close to the pin as possible.
38
SW3AFB (6)
I
3.6 V
Analog
Output voltage feedback for SW3A. Route this trace separately from the high
current path and terminate at the output capacitance.
39
VGEN5
O
3.6 V
Analog
VGEN5 regulator output. Bypass with a 2.2
μF ceramic output capacitor.
40
VIN3
I
4.8 V
Analog
VGEN5, 6 input. Bypass with a 1.0
μF decoupling capacitor as close to the
pin as possible.
41
VGEN6
O
3.6 V
Analog
VGEN6 regulator output. By pass with a 2.2
μF ceramic output capacitor.
42
LICELL
I/O
3.6 V
Analog
Coin cell supply input/output
43
VSNVS
O
3.6 V
Analog
LDO or coin cell output to processor
44
SWBSTFB (6)
I
5.5 V
Analog
Boost regulator feedback. Connect this pin to the output rail close to the
load. Keep this trace away from other noisy traces and planes.
45
SWBSTIN (6)
I
4.8 V
Analog
Input to SWBST regulator. Bypass with at least a 2.2
μF ceramic capacitor
and a 0.1
μF decoupling capacitor as close to the pin as possible.
46
SWBSTLX (6)
O
7.5 V
Analog
SWBST switch node connection
47
VDDOTP
I
10 V(5)
Digital and
Analog
Supply to program OTP fuses
48
GNDREF
GND
-
GND
Ground reference for the main band gap regulator.
49
VCORE
O
3.6 V
Analog
Analog Core supply
50
VIN
I
4.8 V
Analog
Main chip supply
51
VCOREDIG
O
1.5 V
Analog
Digital Core supply
52
VCOREREF
O
1.5 V
Analog
Main band gap reference
53
SDA
I/O
3.6 V
Digital
I2C data line (Open drain)
54
SCL
I
3.6 V
Digital
I2C clock
55
VDDIO
I
3.6 V
Analog
Supply for I2C bus. Bypass with 0.1
μF ceramic capacitor
56
PWRON
I
3.6 V
Digital
Power On/off from processor
-
EP
GND
-
GND
Expose pad. Functions as ground return for buck regulators. Tie this pad to
the inner and external ground planes through vias to allow effective thermal
dissipation.
Notes
5.
10 V Maximum voltage rating during OTP fuse programming. 7.5 V Maximum DC voltage rated otherwise.
6.
Unused switching regulators should be connected as follow: Pins SWxLX and SWxFB should be unconnected and Pin SWxIN should be
connected to VIN with a 0.1
μF bypass capacitor.
Table 4. PF0100 pin definitions (continued)
Pin number
Pin name
Pin
function
Max rating
Type
Definition



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