LM5176PWPR datasheet(4/45 Pages) TI2

4 / 45 page

Table 5-1. Pin Functions (continued)

I/O

DESCRIPTION

NAME

HTSSOP

QFN

VOSNS

VOUT sense input. Connect to the power stage output rail.

ISNS(–)

ISNS(+)

Input or output current sense amplifier inputs. An optional current sense resistor connected

between ISNS(+) and ISNS(–) can be located either on the input side or on the output

side of the converter. If the sensed voltage across the ISNS(+) and ISNS(-) pins reaches

50 mV, a slow constant current (CC) control loop becomes active and starts discharging

the soft-start capacitor to regulate the drop across ISNS(+) and ISNS(–) to 50 mV. Short

ISNS(+) and ISNS(–) together to disable this feature.

CSG

The negative or ground input to the PWM current sense amplifier. Connect directly to the

low-side (ground) of the current sense resistor.

The positive input to the PWM current sense amplifier

PGOOD

Power-Good open drain output. PGOOD is pulled low when FB is outside a -9%/+10%

regulation window around the 0.8-V VREF.

SW2

SW1

The boost and the buck side switching nodes, respectively.

HDRV2

HDRV1

Output of the high-side gate drivers. Connect directly to the gates of the high-side

MOSFETs.

BOOT2

BOOT1

An external capacitor is required between the BOOT1, BOOT2 pins and the SW1, SW2

pins respectively to provide bias to the high-side MOSFET gate drivers.

LDRV2

LDRV1

Output of the low-side gate drivers. Connect directly to the gates of the low-side

MOSFETs.

PGND

Power ground of the IC. The high current ground connection to the low-side gate drivers

VCC

I/O/P

Output of the VCC bias regulator. Connect capacitor to ground.

BIAS

I/P

Optional input to the VCC bias regulator. Powering VCC from an external supply instead

of VIN can reduce power loss at high VIN. For VBIAS > 8 V, the VCC regulator draws power

from the BIAS pin.

PowerPAD™

—

Solder the PowerPAD to the analog ground. If possible, use thermal vias to connect to a

PCB ground plane for improved power dissipation.

LM5176

SNVSAI1D – JUNE 2017 – REVISED AUGUST 2021

www.ti.com

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