Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over the –40°C to 125°C junction temperature

range unless otherwise stated. VIN = 24 V unless otherwise stated.(1)

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

PGOOD

VPGD

PGOOD trip threshold for falling FB

Measured with respect to VREF

–9%

PGOOD trip threshold for rising FB

Measured with respect to VREF

10%

Hysteresis

2.5%

ILEAK(PGD)

PGOOD leakage current

100

nA

ISINK(PGD)

PGOOD sink current

VPGOOD = 0.4 V

2

4.2

6.5

mA

OUTPUT OVP

VOVP

Output overvoltage threshold at FB pin

Measured with respect to VREF

10%

Hysteresis

2.5%

NMOS DRIVERS

IHDRV1,2

Driver peak source current

VBOOT - VSW = 7 V

1.8

A

Driver peak sink current

VBOOT - VSW = 7 V

2.2

A

ILDRV1,2

Driver peak source current

1.8

A

Driver peak sink current

2.2

A

RHDRV1,2

Driver pullup resistance

VBOOT - VSW = 7 V

1.8

Ω

Driver pulldown resistance

VBOOT - VSW = 7 V

1.1

Ω

VUV(BOOT1,2)

BOOT1,2 to SW1,2 UVLO threshold

HDRV1,2 shut off

3.4

V

BOOT1,2 to SW1,2 UVLO hysteresis

HDRV1,2 start switching

150

mV

RLDRV1,2

Driver pullup resistance

1.7

Ω

Driver pulldown resistance

1.3

Ω

tDT1

Dead time HDRV1,2 off to LDRV1,2 on

45

ns

tDT2

Dead time LDRV1,2 off to HDRV1,2 on

45

ns

THERMAL SHUTDOWN

TSD

Thermal shutdown temperature

165

°C

TSD(HYS)

Thermal shutdown hysteresis

15

°C

(1)

All minimum and maximum limits are specified by correlating the electrical characteristics to process and temperature variations and

applying statistical process control.

LM5176

SNVSAI1D – JUNE 2017 – REVISED AUGUST 2021

www.ti.com

8

Submit Document Feedback

Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: LM5176