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SPMCK16Z4MPV16 Datasheet(PDF) 295 Page - Freescale Semiconductor, Inc

Part # SPMCK16Z4MPV16
Description  M68HC16Z Series
PDF  500 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

SPMCK16Z4MPV16 Datasheet(HTML) 295 Page - Freescale Semiconductor, Inc

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M68HC16 Z SERIES
ELECTRICAL CHARACTERISTICS
USER’S MANUAL
A-11
17
MC68CM16Z1/Z4 Power Dissipation11
PD
—
191
mW
18
Input Capacitance2, 7
All input-only pins
All input/output pins
Cin
—
—
10
20
pF
19
Load Capacitance2
Group 1 I/O Pins, CLKOUT, FREEZE/QUOT, IPIPE0
Group 2 I/O Pins and CSBOOT, BG/CS
Group 3 I/O Pins
Group 4 I/O Pins
CL
—
—
—
—
90
100
100
100
pF
NOTES:
1. Applies to:
Port ADA [7:0] — AN[7:0]
Port E [7:4] — SIZ[1:0], AS, DS
Port F [7:0] — IRQ[7:1], MODCLK
Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1
Port MCCI[7:0] — TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO
BKPT/DSCLK, DSI/IPIPE1, PAI, PCLK, RESET, RXD, TSC
2. Input-Only Pins: EXTAL, TSC, BKPT/DSCLK, PAI, PCLK, RXD
Output-Only Pins: CSBOOT, BG/CS1, CLKOUT, FREEZE/QUOT, DSO/IPIPE0, PWMA, PWMB
Input/Output Pins:
Group 1: Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1, DATA[15:0], DSI/IPIPE1
Group 2: Port C[6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3]
Port E[7:0] — SIZ[1:0], AS, DS, AVEC, DSACK[1:0]
Port F[7:0] — IRQ[7:1], MODCLK
Port MCCI[7:3] — TXD, PCS[3:1], PCS0/SS, ADDR23/CS10/ECLK
Group 3: HALT, RESET
Group 4: MISO, MOSI, SCK
3. Does not apply to HALT and RESET because they are open drain pins.
Does not apply to port MCCI[7:0] (TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO) in wired-OR mode.
4. Use of an active pulldown device is recommended.
5. Total operating current is the sum of the appropriate IDD, IDDSYN, ISB, and IDDA.
6. Current measured with system clock frequency of 16.78 MHz, all modules active.
7. This parameter is periodically sampled rather than 100% tested.
8. CPU16 in WAIT, all other modules inactive.
9. The RAM module will not switch into standby mode as long as VSB does not exceed VDD by more than 0.5 Volt.
The RAM array cannot be accessed while the module is in standby mode.
10. When VDD is transitioning during a power up or power down sequence, and VSB is applied, current flows between
the VSTBY and VDD pins, which causes standby current to increase toward the maximum transient condition spec-
ification. System noise on the VDD and VSTBY pins can contribute to this condition.
11. Power dissipation measured at specified system clock frequency, all modules active. Power dissipation can be
calculated using the expression:
PD = Maximum VDD (IDD + IDDSYN + ISB) + Maximum VDDA (IDDA)
IDD includes supply currents for all device modules powered by VDD pins.
Table A-11 Low Voltage 16.78-MHz DC Characteristics (Continued)
(V
DD
and V
DDSYN
= 2.7 to 3.6Vdc, V
SS
= 0 Vdc, T
A
= T
L
to T
H)
Num
Characteristic
Symbol
Min
Max
Unit
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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