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SPMCK16Z4MPV16 Datasheet(PDF) 295 Page - Freescale Semiconductor, Inc |
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SPMCK16Z4MPV16 Datasheet(HTML) 295 Page - Freescale Semiconductor, Inc |
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295 / 500 page ![]() M68HC16 Z SERIES ELECTRICAL CHARACTERISTICS USER’S MANUAL A-11 17 MC68CM16Z1/Z4 Power Dissipation11 PD — 191 mW 18 Input Capacitance2, 7 All input-only pins All input/output pins Cin — — 10 20 pF 19 Load Capacitance2 Group 1 I/O Pins, CLKOUT, FREEZE/QUOT, IPIPE0 Group 2 I/O Pins and CSBOOT, BG/CS Group 3 I/O Pins Group 4 I/O Pins CL — — — — 90 100 100 100 pF NOTES: 1. Applies to: Port ADA [7:0] — AN[7:0] Port E [7:4] — SIZ[1:0], AS, DS Port F [7:0] — IRQ[7:1], MODCLK Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1 Port MCCI[7:0] — TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO BKPT/DSCLK, DSI/IPIPE1, PAI, PCLK, RESET, RXD, TSC 2. Input-Only Pins: EXTAL, TSC, BKPT/DSCLK, PAI, PCLK, RXD Output-Only Pins: CSBOOT, BG/CS1, CLKOUT, FREEZE/QUOT, DSO/IPIPE0, PWMA, PWMB Input/Output Pins: Group 1: Port GP[7:0] — IC4/OC5/OC1, IC[3:1], OC[4:1]/OC1, DATA[15:0], DSI/IPIPE1 Group 2: Port C[6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3] Port E[7:0] — SIZ[1:0], AS, DS, AVEC, DSACK[1:0] Port F[7:0] — IRQ[7:1], MODCLK Port MCCI[7:3] — TXD, PCS[3:1], PCS0/SS, ADDR23/CS10/ECLK Group 3: HALT, RESET Group 4: MISO, MOSI, SCK 3. Does not apply to HALT and RESET because they are open drain pins. Does not apply to port MCCI[7:0] (TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO) in wired-OR mode. 4. Use of an active pulldown device is recommended. 5. Total operating current is the sum of the appropriate IDD, IDDSYN, ISB, and IDDA. 6. Current measured with system clock frequency of 16.78 MHz, all modules active. 7. This parameter is periodically sampled rather than 100% tested. 8. CPU16 in WAIT, all other modules inactive. 9. The RAM module will not switch into standby mode as long as VSB does not exceed VDD by more than 0.5 Volt. The RAM array cannot be accessed while the module is in standby mode. 10. When VDD is transitioning during a power up or power down sequence, and VSB is applied, current flows between the VSTBY and VDD pins, which causes standby current to increase toward the maximum transient condition spec- ification. System noise on the VDD and VSTBY pins can contribute to this condition. 11. Power dissipation measured at specified system clock frequency, all modules active. Power dissipation can be calculated using the expression: PD = Maximum VDD (IDD + IDDSYN + ISB) + Maximum VDDA (IDDA) IDD includes supply currents for all device modules powered by VDD pins. Table A-11 Low Voltage 16.78-MHz DC Characteristics (Continued) (V DD and V DDSYN = 2.7 to 3.6Vdc, V SS = 0 Vdc, T A = T L to T H) Num Characteristic Symbol Min Max Unit Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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