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KM416RD8AS-RBM80 Datasheet(PDF) 61 Page - Samsung semiconductor |
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KM416RD8AS-RBM80 Datasheet(HTML) 61 Page - Samsung semiconductor |
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61 / 64 page ![]() Page 58 KM416RD8AS Direct RDRAM™ Rev. 0.9July 1999 Target Center-Bonded uBGA Package Figure 61 shows the form and dimensions of the recom- mended package for the center-bonded CSP device class. Figure 61: Center-Bonded uBGA Package Table 27 lists the numerical values corresponding to dimen- sions shown in Figure 61. Table 27: Center-Bonded uBGA Package Dimensions A B C D E F G H J 1 2 3 4 5 6 D A e1 d E E1 e2 Top Bottom Top Bottom 7 Symbol Parameter Min Max Unit e1 Ball pitch (x-axis) 1.27 1.27 mm e2 Ball pitch (y-axis) 1.27 1.27 mm A Package body length 11.9 12.1 mm D Package body width 11.7 11.9 mm E Package total thickness - 1.25 mm E1 Ball height 0.45 0.55 mm d Ball diameter 0.55 0.65 mm |
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