6

PCB Assembly Considerations

Figure 5. Exploded view drawing

1. Insert the sensor and all other electrical components

into PCB.

2. Insert the LED into the assembly clip and bend the

leads 90 degrees.

3. Insert the LED/clip assembly into PCB.

4. This sensor package is only qualified for wave-solder

process.

5. Wave Solder the entire assembly in a no-wash solder

process utilizing solder fixture. The solder fixture is

needed to protect the sensor during the solder pro-

cess. It also sets the correct sensor-to -PCB distance as

the lead shoulders do not normally rest on the PCB

surface. The fixture should be designed to expose

the sensor leads to solder while shielding the optical

aperture from direct solder contact.

Figure 6. Block diagram of ADNS-3090 optical mouse sensor

IMAGE

PROCESSOR

REFERENCE

VOLTAGE

FILTER NODE

3.3 V POWER

REFB

REFC

GND

RESONATOR

OSC_IN

OSC_OUT

MOSI

NCS

SCLK

OPTP

VDD3

MISO

LED_CTRL

RESET

NPD

CTRL

OSCILLATOR

6. Place the lens onto the base plate.

7. Remove the protective kapton tape from optical ap-

erture of the sensor. Care must be taken to keep con-

taminants from entering the aperture. During mouse

assembly process, it is recommended that the PCB is

held vertically when kapton tapes are being removed.

8. Insert PCB assembly over the lens onto the base plate

aligning post to retain PCB assembly. The sensor ap-

erture ring should self-align to the lens.

9. The optical position reference for the PCB is set by the

base plate and lens. Note that the PCB motion due to

button presses must be minimized to maintain optical

alignment.

10. Install mouse top case. There MUST be a feature in the

top case to press down

HLMP-EG3E-xxxxx (LED)

ADNS-2220-001 (Clip)

ADNS-3090 (Sensor)

Customer supplied PCB

ADNS-2120-001 (Trim Lens)

Customer supplied base plate

with recommended alignment

features per IGES drawing.

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PixArt Imaging Inc.

PixArt Imaging Inc.