PCM3168APAPR datasheet(8/66 Pages) TI1

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PCM3168A

SBAS452A – SEPTEMBER 2008 – REVISED JANUARY 2016

www.ti.com

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Electrostatic

V(ESD)

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

VCC

Analog supply voltage

4.5

5.0

5.5

VDD

Digital supply voltage

3.0

3.3

3.6

Digital Interface

LVTTL compatible

Sampling frequency, LRCKAD/LRCKDA(1)

96/192(1)

kHz

Digital input clock frequency

System clock frequency, SCKI

2.048

36.864

MHz

Single-ended

VRMS

Analog input level

Differential

VRMS

Analog output voltage

Differential

VPP

To AC-coupled GND

Ω

VOLR

Analog output load resistance

To DC-coupled GND

Ω

VOLC

Analog output load capacitance

DOLC

Digital output load capacitance

Operating free-air

PCM3168A Consumer grade

–40

°C

temperature

(1)

192 kHz is supported only for DAC.

8.4 Thermal Information

PCM3168A

THERMAL METRIC(1)

PAP (HTQFP)

UNIT

64 PINS

RθJA

Junction-to-ambient thermal resistance

26.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

7.7

°C/W

RθJB

Junction-to-board thermal resistance

8.9

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

8.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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