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HMC832LP6GETR Datasheet(PDF) 7 Page - Analog Devices

Part # HMC832LP6GETR
Description  Cellular infrastructure
PDF  49 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

HMC832LP6GETR Datasheet(HTML) 7 Page - Analog Devices

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HMC832
Data Sheet
Rev. A | Page 6 of 48
ABSOLUTE MAXIMUM RATINGS
Table 4. Absolute Maximum Ratings
Parameter
Rating
AVDD, RVDD, DVDD, VCCPD, VCCHF, VCCPS
 
−0.3 V to +3.6 V
VPPCP, VDDLS, VCC1
−0.3 V to +3.6 V
VCC2
−0.3 V to +3.6 V
Operating Temperature
−40°C to +85°C
Storage Temperature
−65°C to +150°C
Maximum Junction Temperature
150°C
Thermal Resistance (
θJC) (Junction to Case (Ground
Paddle))
9°C/W
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
40 sec
ESD Sensitivity (HBM)
Class 1B
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
RECOMMENDED OPERATING CONDITIONS
Table 5. Recommended Operating Conditions
Parameter
Min
Typ
Max
Units
Temperature
Junction Temperature1
125
°C
Ambient Temperature
−40
+85
°C
Supply Voltage
AVDD, RVDD, DVDD, VCCPD, VCCHF,
VCCPS, VPPCP, VDDLS, VCC1, VCC2
3.1
3.3
3.5
V
1 Layout design guidelines set out in Qualification Test Report are strongly
recommended.
ESD CAUTION



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