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NTP53X2 Datasheet(PDF) 115 Page - NXP Semiconductors |
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NTP53X2 Datasheet(HTML) 115 Page - NXP Semiconductors |
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115 / 133 page  NXP Semiconductors NTP53x2 NTAG 5 link - NFC Forum-compliant I2C bridge NTP53x2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Product data sheet Rev. 3.3 — 3 July 2020 COMPANY PUBLIC 544533 115 / 133 Symbol Parameter Conditions Min Typ Max Unit Istandby Vcc standby current VCC = 3.3 V wake-up via I2C - 5.9 18 µA Istandby Vcc standby current VCC = 5.5 V wake-up via I2C - 6.9 21 µA Ihrd_pwr_dwn Vcc hard power down current VCC = 1.8 V; XQFN16 package only - 0.23 2.3 µA Ihrd_pwr_dwn Vcc hard power down current VCC = 3.3 V; XQFN16 package only - 0.25 3.44 µA Ihrd_pwr_dwn Vcc hard power down current VCC = 5.5 V; XQFN16 package only - 0.31 5.72 µA Energy harvesting VOUT pad configured to 1.8 V; load current <= configured output current 1.62 - 1.98 V configured to 2.4 V; load current <= configured output current 2.16 - 2.64 V Vout output voltage configured to 3.0 V; load current <= configured output current 2.7 - 3.3 V Iout min. output current at different regulated output voltages when current detection is enabled and dependent on selected output current value 0.4 - 12.5 mA ED pin characteristics VOL LOW-level output voltage IOL = 3 mA - - 0.4 V IIED leakage current VIN = 0 V to 5.5 V 10 - 1000 nA HPD pin characteristics for XQFN16 package VIL LOW-level input voltage 0 - 0.3*VCC V VIH HIGH-level input voltage 0.7*VCC - VCC V IIL LOW-level input current VIN = 0 V -1 - - µA IIH HIGH-level input current VIN = 5.5 V - - 1 µA Ci input capacitance - - 1.2 pF GPIO pad pin characteristics in I2C mode VIH HIGH-level input voltage 0.7*VCC - - V VIL LOW-level input voltage - - 0.3*VCC V IIL LOW-level input current VIN = 0 V -1 - - µA IIH HIGH-level input current VIN = 5.5 V - - 1 µA VOH HIGH-level output voltage IOH < 3 mA 0.7*VCC - VCC V VOL LOW-level output voltage IOL < 3 mA 0 - 0.4 V Ci input capacitance - - 3.5 pF |
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