FS32R274VCK2MMM datasheet(70/78 Pages) NXP

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Thermal Specifications

15.1 Thermal characteristics

Table 55. 257MAPBGA package thermal characteristics

Symbol

Parameter

Conditions

257MAPBGA

Unit

RθJA

Thermal resistance, junction-to-ambient natural

convection 1, 2

Single layer board - 1s

41.8

°C/W

Four layer board - 2s2p3

22.3

RθJMA

Thermal resistance, junction-to-ambient forced

convection at 200 ft/min1, 3

Single layer board - 1s

29.8

°C/W

Four layer board - 2s2p

17.7

RθJB

Thermal resistance junction-to-board4

—

7.6

°C/W

RθJC

Thermal resistance junction-to-case5

—

5.2

°C/W

ΨJT

Junction-to-package-top natural convection6

—

0.2

°C/W

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package. Board temperature is measured on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

6. Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2.

15.1.1 General notes for specifications at maximum junction

temperature

An estimation of the chip junction temperature, TJ, can be obtained from this equation:

TJ = TA + (RθJA × PD)

TJ = TBRD + (RθJB × PD)

where:

• TA = ambient temperature for the package (°C)

• RθJA = junction to ambient thermal resistance (°C/W)

• RθJB = junction to board thermal resistance (°C/W)

• TθBRD = average board temperature just outside the package periphery (°C)

• PD = power dissipation in the package (W)

Thermal Specifications

S32R274/S32R264 Series Data Sheet, Rev. 6, 06/2021

NXP Semiconductors

FS32R274VCK2MMM Datasheet(PDF) 70 Page - NXP Semiconductors

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